En poursuivant votre navigation sur ce site, vous acceptez le dépôt de cookies dans votre navigateur. (En savoir plus)

Flexible electronics based on 1D/2D (H/F)

This offer is available in the following languages:
Français - Anglais

Date Limite Candidature : mercredi 24 mars 2021

Assurez-vous que votre profil candidat soit correctement renseigné avant de postuler. Les informations de votre profil complètent celles associées à chaque candidature. Afin d’augmenter votre visibilité sur notre Portail Emploi et ainsi permettre aux recruteurs de consulter votre profil candidat, vous avez la possibilité de déposer votre CV dans notre CVThèque en un clic !

Faites connaître cette offre !

General information

Reference : UMR8520-EMIPAL-003
Workplace : VILLENEUVE D ASCQ
Date of publication : Wednesday, February 10, 2021
Scientific Responsible name : Henri Happy
Type of Contract : PhD Student contract / Thesis offer
Contract Period : 36 months
Start date of the thesis : 5 April 2021
Proportion of work : Full time
Remuneration : 2 135,00 € gross monthly

Description of the thesis topic

Printed electronics is a set of printing methods for depositing electronic materials (insulating, conducting, and semiconducting) onto arbitrary substrates to create a wide range of devices, such as organic thin film transistors (OTFTs), light-emitting devices (LEDs), diodes, detectors, etc. Among different printed techniques, inkjet printed approach is a suitable and low cost (avoid waste of material) technology for flexible electronics, when high resolution is the main criteria. However, improving the quality and the reliability of printed patterns in terms of geometry and resolution remain challenging. It means, the printed pattern dimensions must be as close as possible to the designed value, and the pattern defects such as holes and the rough pattern boundary must be well controlled.

1)- Develop original large scale / Low cost fabrication methods with high reliability
Here, we will mainly consider inkjet printed approach as the most deposition technique. Attention will be paid on devices requiring high resolution, with a good reliability, and lower loss. For this objective, (i) the design and fabrication of passive devices requiring high resolution such as low impedance transmission lines, filters, antennas will be made. Similarly, (ii) the design and fabrication of active devices using 2D materials with short drain-source contacts (around μm) will be explored. 2D materials in solution such as CVD MoS2 and WSe2 will be used as active layers transferred from rigid substrates, or solution processed materials as CNTs, which have demonstrated to provide good high on/off ratios as well as large mobilities. Dielectrics as parylene or Al2O3 will be taken into account, which have the potentials to be exploited at high frequencies.

2)- Demonstrate functional fast and flexible prototype circuits combining several types of
building blocks of active and passive devices. We consider that if the first part is succesfull, the project will gather the necessary elements to climb from devices to circuits and functions. Indeed, by extracting electrical circuit of active and passives devices, il will be possible to design and fabricate with fully printed technology digital and analogue circuits with different functionalities. Conventional demonstrators will be first targeted : complementary inverters, oscillators, amplifiers. They do not constitute ulimate targets, but represent natural milestone in the project roadmap. The choice of original functions will be defined during the course of the project.

3)- Benchmark the functionality for applications in several domains of these circuits against other technologies. After characterization of electronic circuits and systems, we will envision the decisive progresses in the field of IoT and potentially in the field of sensors.

Work Context

This PhD thesis is part of the EU-Graphene-Flagship project and it will carried out under the supervision of Pr. Happy, the deputy leader of the Flexible Electronics Work Package.In particular, we will collaborate closely with the University of Pisa team. The successful candidate will join the Carbon team at IEMN which has already a strong experience in printed electronics and high-frequency applications.

Constraints and risks

Work in a clean room environment.

Additional Information

-

We talk about it on Twitter!