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Portal > Offres > Offre UMR5129-MARCLO-033 - Chercheur H/F en procédés de gravure plasma pour la photonique intégrée sur Silicium

Researcher (H/F) in plasma etching processes for Si photonics

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Français - Anglais

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General information

Reference : UMR5129-MARCLO-033
Workplace : GRENOBLE
Date of publication : Friday, June 19, 2020
Type of Contract : FTC Scientist
Contract Period : 12 months
Expected date of employment : 1 September 2020
Proportion of work : Full time
Remuneration : Between 2648.79€ and 3054.06€ gross monthly
Desired level of education : PhD
Experience required : 1 to 4 years


This work is part of the photonics program of Nano 2022 local government project piloted by STMicroelectronics. The overall objective of this project is to develop innovative technologies and processes in order to improve the performance of photonic devices integrated on a silicon platform. In particular, the optical performance of the Si or SiN waveguides is intimately linked to the quality of the plasma etching processes involved in their fabrication . A well-known example is the detrimental impact of the sidewalls roughness of the waveguide on optical propagation losses. The objective of this postdoc is to fabricate Si and SiN waveguides with ultra-low optical losses. To do this, the first task will be to develop plasma etching processes dedicated to the patterning of waveguides with with minimum sidewalls roughness in order to reduce optical scattering losses. One promising way for achieving this o is to use pulsed plasma technologies, available at the LTM / CNRS, which offer a multitude of possibilities for patterning materials without damage. The second task will consist in exploring other ways to get rid of the other sources of optical losses (for example by introducing waveguide annealing treatment or by proposing other strategies of encapsulation of the guides after patterning).


The work will be carried out in the LTM 200 and 300mm etching reactors located in the CEA / Leti clean rooms, the 300mm reactor being equipped with pulsed plasma technologies:
- Development of pulsed plasma etching processes of Si and SiN waveguides
- Comparison of performance of continuous and pulsed plasma processes in terms of waveguide morphology
- Annealing development adapted to further smooth the waveguides or modify their optical properties
- Development of encapsulation strategy for guides other than SiO2
- Characterization of the optical losses of the waveguides and comparison of the performances obtained according to the established process
- Valuation of results in the form of articles or communications at conferences


1) Theoretical knowledge: plasma etching mechanisms, materials science, basics on linear and non-linear optics will be appreciated
2) Technical skills:
- Plasma etching processes,
- Plasma diagnostics (mass spectro, flow probe, etc.),
- Characterization of the etching processes (morphology by SEM, MEB-CD, ellipsometry and roughness by AFM and MEB-CD)
- characterization of materials (XPS, FTIR,)
- Optical characterization (optical loss measurements in guides or quality factor measurements in a microresonator)
3) Skills in valuing results by writing articles or presenting at conferences
4) other skills: written / spoken English, knowledge of Matlab programming

Work Context

This work will be carried out at the Microelectronics Technologies Laboratory (LTM), a joint research unit of the CNRS and the Grenoble Alpes University (UGA) (UMR 5129) located on the CEA-LETI-MINATEC site in Grenoble. A hundred people work at the LTM: 30 researchers or teacher-researchers, 18 engineers and technicians, 31 doctoral students and 16 post-doc. The laboratory's activities are positioned on the border between upstream academic research and industrial research. Over the years, the LTM has developed several direct partnerships with various players in the micro / nanoelectronics industry, notably STMicroelectronics in Crolles and Applied Materials in SAnta Clara (USA). The candidate will join the LTM's plasma etching team, made up of 5 non-permanent 5/6 researchers. This team aims to develop innovative plasma etching processes developed in latest generation industrial etching reactors to meet the challenges of patterning materials for any type of application.

Constraints and risks


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